10 - 11 Feb 2025
Workshop
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IC Packaging Technology Course 2025
Timings
09:00 AM-06:00 PM (expected)
Entry Fees
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Estimated Turnout
Delegates
Events type
Workshop
Event Details:
- Date: 10 - 11 Feb 2025
- Time: 09:00 AM-06:00 PM (expected)
- Location: USA , Scottsdale
- Type: Workshop
A 2-day course detailing vital IC packaging technologies, focusing on reliability, cost-effectiveness, and quick time-to-market. Covers various packaging technologies and their future directions.
Highlights
- 2-day course on IC packaging technologies.
- Covers pitch conversion, environmental protection, heat transfer, and signal distribution.
- Discusses flip chip area array, Wafer Level Packaging (WLP), Fan-Out Wafer Level Packaging (FO-WLP), and Through Silicon Via (TSV) developments.
- Focus on manufacturing processes, materials selection, and future directions in packaging technologies.
- Emphasis on high-performance product design, manufacturability, functionality, and reliability.
- Networking opportunities with industry experts.
Event Location
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