IC Packaging Technology Course 2025
Description
A 2-day course detailing vital IC packaging technologies, focusing on reliability, cost-effectiveness, and quick time-to-market. Covers various packaging technologies and their future directions.
Highlights
2-day course on IC packaging technologies. Covers pitch conversion, environmental protection, heat transfer, and signal distribution. Discusses flip chip area array, Wafer Level Packaging (WLP), Fan-Out Wafer Level Packaging (FO-WLP), and Through Silicon Via (TSV) developments. Focus on manufacturing processes, materials selection, and future directions in packaging technologies. Emphasis on high-performance product design, manufacturability, functionality, and reliability. Networking opportunities with industry experts.
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