Kilowatt-Level Chip Cooling and Megawatt-Level AI Data Center Cooling Solutions (Advanced Course)

This course focuses on 'Kilowatt-Level Chip Cooling × Megawatt-Level AI Data Center Cooling', guiding students from advanced chip packaging and high heat flux cooling demands to master cutting-edge cooling technologies such as cold plates, immersion cooling, isothermal plates, microchannels, microfluidics, and superfluids. It provides an in-depth analysis of the complete thermal management architecture from chips, modules, and cabinets to data centers. The course also introduces Siemens Flotherm, a professional thermal flow simulation tool, for practical simulations of natural convection, forced convection, liquid cooling systems, and innovative cooling architectures, while optimizing designs to identify more efficient cooling solutions.