WirelessWorkshopTelecommunicationPhysical LayerTop 100 in Telecommunication in Japan

Copper China

Name: Copper China
Start: 2026-05-18T09:00:00+00:00
End: 2026-05-18T18:00:00+00:00
Location: Tokyo, Japan

18 May 202609:00 AM-06:00 PM (expected)Tokyo, JapanDelegates Attendees

Description

Join leading experts in the field at the Workshop on Agentic AI and Wireless Physical Layer Foundation Models, taking place on May 18, 2026, in the vibrant city of Tokyo, Japan. This one-day workshop will delve into the cutting-edge intersection of artificial intelligence and wireless communications, focusing on the development and application of agentic AI within physical layer models. Attendees will have the opportunity to engage in insightful discussions, network with professionals and academics, and explore innovative ideas that shape the future of technology.

Highlights

The workshop is held in conjunction with IEEE INFOCOM 2026, a top-ranked conference on networking. It focuses on Agentic AI and Wireless Physical Layer Foundation Models, aiming to advance intelligent and reasoning-driven 6G networks. Endorsed by one6G, the workshop brings together academic and industrial researchers. Keynote speakers include leading experts from academia and industry. The workshop invites original, unpublished submissions on topics such as agentic wireless architectures, reasoning and decision making, and real-time edge intelligence. Paper submission deadline is January 16, 2026. The event is scheduled for May 18–21, 2026, in Tokyo, Japan. The workshop is part of the IEEE INFOCOM 2026 program, which includes a main technical program, workshops, keynote speeches, panels, and demo/poster sessions.