IC Packaging Technology Course 2025
תיאור
A 2-day course detailing vital IC packaging technologies, focusing on reliability, cost-effectiveness, and quick time-to-market. Covers various packaging technologies and their future directions.
נקודות עיקריות
2-day course on IC packaging technologies. Covers pitch conversion, environmental protection, heat transfer, and signal distribution. Discusses flip chip area array, Wafer Level Packaging (WLP), Fan-Out Wafer Level Packaging (FO-WLP), and Through Silicon Via (TSV) developments. Focus on manufacturing processes, materials selection, and future directions in packaging technologies. Emphasis on high-performance product design, manufacturability, functionality, and reliability. Networking opportunities with industry experts.
מיקום האירוע
תן לרשת שלך לדעת שאתה הולך
שתף אירוע זה כדי להתחיל שיחות, להזמין עמיתים ולהתחבר לפני תחילתו.
